| Mfg Part Number: GC47088-00 | Alternate P/N: GC4708800 | Manufacturer: Microsemi Corp |
| NSN : 5961-01-367-1966 | Item Name : semiconductor devic | CAGE Code : 50101 |
| FSC : 5961 Semiconductor Devices and Associated Hardware |
Thank you for your continued interest in parts like GC47088-00 with the NSN 5961-01-367-1966 currently available for purchase on Zippy Purchasing. The Semiconductor Devic item associated with the part number GC47088-00, by Microsemi Corp, is currently available in our database; as such, we ask that you please fill out and submit an Instant RFQ form detailing your requirements on parts needed. This includes desired quantities, target prices, expected shipping time frames, and more, as applicable. Upon receival, our representatives will harness your provided information and formulate a solution which satisfies your operational needs in just 15 minutes or less.
With our global supply chain stretching across the United States, Zippy Purchasing can provide expedited shipping on select NSN 5961-01-367-1966 orders for entities facing an Aircraft on Ground (AOG) situation or a variety of additional unique time constraints. Operating with a strict NO CHINA Sourcing pledge, all orders are shipped alongside their applicable manufacturer trace documentation or qualifying certifications, ensuring that customers can feel confident in every purchase made. With cost savings and rapid lead times bolstering every order, experience all we have to offer by submitting your RFQ for Semiconductor Devic parts with part number GC47088-00 with the CAGE Code 50101 by Microsemi Corp, today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-367-1966 Item Description: Semiconductor Devic | 5961 | 013671966 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | G | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Gc47088-00 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL |
| ABHP | OVERALL LENGTH | 0.010 INCHES MINIMUM AND 0.020 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.005 INCHES MINIMUM AND 0.010 INCHES MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 1 |
| AXGY | MOUNTING METHOD | THREADED HOLE |
| CBBL | FEATURES PROVIDED | BURN IN AND GOLD PLATED LEADS |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES COLLECTOR CURRENT, DC PEAK |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS PROCESS; JUNCTION PATTERN ARRANGEMENT: PN |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TTQY | TERMINAL TYPE AND QUANTITY | 1 UNTHREADED HOLE AND 1 BONDING PAD |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 80.0 MINIMUM BREAKDOWN VOLTAGE, INSTANTANEOUS |
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