| Mfg Part Number: TIBPAL16R4 20MFKB | Alternate P/N: TIBPAL16R420MFKB | Manufacturer: Texas Instruments Incorporated |
| NSN : 5962-01-262-2716 | Item Name : microcircuit memory | CAGE Code : 01295 |
| FSC : 5962 Microcircuits Electronic |
Thank you for your continued interest in parts like TIBPAL16R4 20MFKB with the NSN 5962-01-262-2716 currently available for purchase on Zippy Purchasing. The Microcircuit Memory item associated with the part number TIBPAL16R4 20MFKB, by Texas Instruments Incorporated, is currently available in our database; as such, we ask that you please fill out and submit an Instant RFQ form detailing your requirements on parts needed. This includes desired quantities, target prices, expected shipping time frames, and more, as applicable. Upon receival, our representatives will harness your provided information and formulate a solution which satisfies your operational needs in just 15 minutes or less.
With our global supply chain stretching across the United States, Zippy Purchasing can provide expedited shipping on select NSN 5962-01-262-2716 orders for entities facing an Aircraft on Ground (AOG) situation or a variety of additional unique time constraints. Operating with a strict NO CHINA Sourcing pledge, all orders are shipped alongside their applicable manufacturer trace documentation or qualifying certifications, ensuring that customers can feel confident in every purchase made. With cost savings and rapid lead times bolstering every order, experience all we have to offer by submitting your RFQ for Microcircuit Memory parts with part number TIBPAL16R4 20MFKB with the CAGE Code 01295 by Texas Instruments Incorporated, today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-262-2716 Item Description: MICROCIRCUIT,MEMORY | 5962 | 012622716 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | G | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-85155 | 5 | 1 | 4 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.350 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.350 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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